Inventor
Hidemichi Kobayashi
Inventor
Chikuma, JP
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics25%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
9,738,014'Resin molding machine'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017Patents assigned to APIC YAMADA CORP (1)· patent assignee history
2017Patents assigned to FUJISAWA MASAHIKO (1)· patent assignee history
2017Patents assigned to HARAYAMA HIROSHI (1)· patent assignee history
2017Patents assigned to KAWAGUCHI MAKOTO (1)· patent assignee history
2017Patents assigned to KOBAYASHI HIDEMICHI (1)· patent assignee history
2017Based in Chikuma, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APIC YAMADA CORP | 1 | 2017 |
| FUJISAWA MASAHIKO | 1 | 2017 |
| HARAYAMA HIROSHI | 1 | 2017 |
| KAWAGUCHI MAKOTO | 1 | 2017 |
| KOBAYASHI HIDEMICHIself | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chikuma, JP | 1 | 2017 |