Inventor
TAKAHIRO TSUCHIYA
Inventor
JP
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections27%
H02KDynamo-electric machines9%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for5%
B60TVehicle brake control systems or parts thereof5%
F01LCyclically operating valves for machines or engines5%
F01PCooling of machines or engines in general5%
F02DControlling combustion engines5%
F16DCouplings for transmitting rotation5%
G08GTraffic control systems5%
H01LSemiconductor devices5%
PatentTitleYear
12,592,510Connector having resilent portion for pressing terminal fitting202612,548,892Antenna apparatus, system, communication apparatus, data processing apparatus, and computer readable storage medium202612,355,175Female terminal fitting with elastic contact piece engageable with body part202512,347,715Electrostatic chuck device power supply, electrostatic chuck device, and dechuck control method202511,670,886Connector having improved holding force for terminal202311,670,885Terminal fitting with body portion including walls202311,649,742Attachment structure for vehicle motor, in-vehicle equipment, and brushless motor202311,217,925Female terminal202211,217,914Ground terminal202211,165,292Motor2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2023Patents assigned to DENSO CORP (2)· patent assignee history
2021–2026Based in JP· patent location history
2022–2026Patents assigned to SUMITOMO WIRING SYSTEMS (6)· patent assignee history
2025Patents assigned to HAMAMATSU PHOTONICS KK (1)· patent assignee history
2026Patents assigned to SOFTBANK CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SUMITOMO WIRING SYSTEMS | 6 | 2022–2026 |
| DENSO CORP | 2 | 2021–2023 |
| HAMAMATSU PHOTONICS KK | 1 | 2025 |
| SOFTBANK CORP | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 10 | 2021–2026 |