Inventor
Sukeyoshi Tsunekawa
Inventor
Iruma, JP
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10DInorganic electric semiconductor devices14%
C23CCoating metallic material10%
C23FNon-mechanical removal of metallic material from surface9%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis7%
C03CChemical composition of glasses, glazes or vitreous enamels5%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H10BElectronic memory devices5%
PatentTitleYear
7,645,509'Removal method for coating of polymer coated glass capillary tubing and polymer coated glass capillary tubing'20107,419,577'Removal method for coating of polymer coated glass capillary tubing and polymer coated glass capillary tubing'20087,264,677'Process for treating solid surface and substrate surface'20077,025,896'Process for treating solid surface and substrate surface'20066,821,446'Removal method for coating of polymer coated glass capillary tubing and polymer coated glass capillary tubing'20046,664,184'Method for manufacturing semiconductor device having an etching treatment'20036,613,242'Process for treating solid surface and substrate surface'20036,607,988'Manufacturing method of semiconductor integrated circuit device'20036,537,461'Process for treating solid surface and substrate surface'20036,451,665'Method of manufacturing a semiconductor integrated circuit'20026,326,218'Semiconductor integrated circuit and its manufacturing method'20015,747,387'Removal method of organic matter and system for the same'19985,503,708'Method of and apparatus for removing an organic film'19965,478,401'Apparatus and method for surface treatment'19954,792,842'Semiconductor device with wiring layer using bias sputtering'19884,717,462'Sputtering apparatus'19884,599,135'Thin film deposition'19864,394,245'Sputtering apparatus'1983Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1983–2010Patents assigned to HITACHI LTD (16)· patent assignee history
1983Based in Hachioji, JP· patent location history
1986–1996Based in Tokorozawa, JP· patent location history
1998Patents assigned to HITACHI MICROCOMPUTER SYST (1)· patent assignee history
1998–2010Based in Iruma, JP· patent location history
2003Based in Tokyo, JP· patent location history
2006–2007Patents assigned to RENESAS TECH CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 16 | 1983–2010 |
| RENESAS TECH CORP | 2 | 2006–2007 |
| HITACHI MICROCOMPUTER SYST | 1 | 1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Iruma, JP | 10 | 1998–2010 |
| Tokorozawa, JP | 5 | 1986–1996 |
| Tokyo, JP | 2 | 2003 |
| Hachioji, JP | 1 | 1983 |