Inventor
Sushumna Iruvanti
Inventor
Wappingers Falls, NY, US
Overview
Patents· 55 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%
H01LSemiconductor devices10%
Y10TTechnical subjects covered by former us classification7%
H05KPrinted circuits4%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%
C08LCompositions of macromolecular compounds4%
C09KMaterials for miscellaneous applications, not provided for elsewhere4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B82YSpecific uses or applications of nanostructures2%
PatentTitleYear
10,892,233Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers202110,804,181Heterogeneous thermal interface material for corner and or edge degradation mitigation202010,636,746Method of forming an electronic package202010,607,928Reduction of laminate failure in integrated circuit (IC) device carrier202010,593,564Lid attach optimization to limit electronic package warpage202010,381,276Test cell for laminate and method201910,332,813Lid attach optimization to limit electronic package warpage201910,249,548Test cell for laminate and method201910,083,886Lid attach optimization to limit electronic package warpage201810,049,896Lid attach optimization to limit electronic package warpage20189,947,603Lid attach optimization to limit electronic package warpage20189,512,291'High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites'20169,045,674'High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites'20158,531,025'Thermal paste containment for semiconductor modules'20138,455,998'Method and package for circuit chip packaging'20138,232,636'Reliability enhancement of metal thermal interface'20128,156,998'Patterned metal thermal interface'20128,053,284'Method and package for circuit chip packaging'20118,021,925'Thermal paste containment for semiconductor modules'20117,981,849'Reversible thermal thickening grease'20117,964,542'Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly'20117,816,785'Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package'20107,709,951'Thermal pillow'20107,694,719'Patterned metal thermal interface'20107,615,850'Method and device including reworkable alpha particle barrier and corrosion barrier'20097,381,590'Method and device including reworkable alpha particle barrier and corrosion barrier'20087,268,428'Thermal paste containment for semiconductor modules'20077,239,516'Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip'20076,656,389'Thermal paste for low temperature applications'20036,515,061'Polyester dispersants for high thermal conductivity paste'20036,444,496'Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof'20026,373,133'Multi-chip module and heat-sink cap combination'20026,294,408'Method for controlling thermal interface gap distance'20016,275,381'Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof'20016,255,139'Method for providing a thermal path through particles embedded in a thermal cap'20016,214,647'Method for bonding heatsink to multiple-height chip'20016,111,314'Thermal cap with embedded particles'20006,085,831'Direct chip-cooling through liquid vaporization heat exchange'20005,990,418'Hermetic CBGA/CCGA structure with thermal paste cooling'19995,981,310'Multi-chip heat-sink cap assembly'19995,930,597'Reworkable polymer chip encapsulant'19995,891,755'Process for flat plate cooling a semiconductor chip using a thermal paste retainer'19995,881,944'Multi-layer solder seal band for semiconductor substrates'19995,881,945'Multi-layer solder seal band for semiconductor substrates and process'19995,825,087'Integral mesh flat plate cooling module'19985,819,402'Method for cooling of chips using blind holes with customized depth'19985,770,478'Integral mesh flat plate cooling method'19985,757,620'Apparatus for cooling of chips using blind holes with customized depth'19985,724,729'Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials'19985,706,171'Flat plate cooling using a thermal paste retainer'19985,659,203'Reworkable polymer chip encapsulant'19975,623,394'Apparatus for cooling of chips using a plurality of customized thermally conductive materials'19975,604,978'Method for cooling of chips using a plurality of materials'19975,591,789'Polyester dispersants for high thermal conductivity paste'19975,098,609'Stable high solids, high thermal conductivity pastes'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2021Based in Wappingers Falls, NY, US· patent location history
1997–2021Patents assigned to IBM (54)· patent assignee history
2011–2013Based in Hopewell Junction, NY, US· patent location history
2012–2015Patents assigned to IRUVANTI SUSHUMNA (5)· patent assignee history
2012–2013Patents assigned to TOY HILTON T (2)· patent assignee history
2012–2013Patents assigned to ZOU WEI (2)· patent assignee history
2015Patents assigned to BORCA-TASCIUC THEODORIAN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 54 | 1997–2021 |
| IRUVANTI SUSHUMNAself | 5 | 2012–2015 |
| TOY HILTON T | 2 | 2012–2013 |
| ZOU WEI | 2 | 2012–2013 |
| BORCA-TASCIUC THEODORIAN | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 52 | 1992–2021 |
| Hopewell Junction, New York, US | 3 | 2011–2013 |