Inventor
Masayoshi Shinkai
Inventor
Tokyo, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01LSemiconductor devices31%
B23KSoldering or unsoldering15%
H05KPrinted circuits8%
Y10TTechnical subjects covered by former us classification8%
PatentTitleYear
10,658,284Shaped lead terminals for packaging a semiconductor device for electric power202010,104,775Semiconductor device and method for manufacturing the same20189,437,460'Method for manufacturing semiconductor device'20169,087,778'Joining method and semiconductor device manufacturing method'20158,746,538'Joining method and semiconductor device manufacturing method'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2020Patents assigned to MITSUBISHI ELECTRIC CORP (5)· patent assignee history
2014Patents assigned to MUTO AYA (1)· patent assignee history
2014Patents assigned to SHINKAI MASAYOSHI (1)· patent assignee history
2014–2015Based in Chiyoda-ku, JP· patent location history
2016–2020Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 5 | 2014–2020 |
| MUTO AYA | 1 | 2014 |
| SHINKAI MASAYOSHIself | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 3 | 2016–2020 |
| Chiyoda-ku, JP | 2 | 2014–2015 |