LexDanaLexDanabeta
Inventor

XIAOFEI SUN

Inventor
CN

Overview

3→
Patents
2025–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
C08JWorking-up14%
C08LCompositions of macromolecular compounds14%
Y02WClimate change mitigation technologies related to wastewater treatment or waste management14%
PatentTitleYear
12,552,921Films including post consumer resin202612,512,447Semiconductor package assembly and manufacturing method202512,444,727Semiconductor package structure and manufacturing method2025

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2025Patents assigned to CHANGXIN MEMORY TECH INC (2)· patent assignee history
2025Based in CN· patent location history
2026Patents assigned to DOW GLOBAL TECHNOLOGIES LLC (1)· patent assignee history
2026Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANGXIN MEMORY TECH INC22025
DOW GLOBAL TECHNOLOGIES LLC12026
Locations
LocationPatentsSpan
CN22025
US12026