Inventor
CHEN-HUNG TSAI
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
12,543,553Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes202612,376,360Silicide backside contact202511,728,397Integrated circuits having protruding interconnect conductors202311,569,364Silicide backside contact202311,532,480Methods of forming contact features in semiconductor devices2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2022–2026 |