LexDanaLexDanabeta
Inventor

Chun-Hsien Shen

Inventor
Taichung, TW

Overview

2→
Patents
2016
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
9,524,944'Method for fabricating package structure'20169,362,245'Package structure and fabrication method thereof'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (2)· patent assignee history
2016Patents assigned to HUANG FU-TANG (1)· patent assignee history
2016Patents assigned to LAI YA-YI (1)· patent assignee history
2016Patents assigned to LI HSIU-JUNG (1)· patent assignee history
2016Patents assigned to SHEN CHUN-HSIEN (1)· patent assignee history
2016Based in Taichung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SILICONWARE PRECISION INDUSTRIES CO LTD22016
HUANG FU-TANG12016
LAI YA-YI12016
LI HSIU-JUNG12016
SHEN CHUN-HSIENself12016
Locations
LocationPatentsSpan
Taichung, TW22016