Inventor
Chee Keong Chin
Inventor
Shanghai, CN
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H01LSemiconductor devices19%
Y10TTechnical subjects covered by former us classification7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
G06KGraphical data reading4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
10,483,239Semiconductor device including dual pad wire bond interconnection201910,418,334Semiconductor device including corner recess201910,283,485Semiconductor device including conductive bump interconnections201910,128,218Semiconductor device including die bond pads at a die edge20188,946,878'Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor'20158,901,439'Integrated circuit package system with window opening'20148,541,886'Integrated circuit packaging system with via and method of manufacture thereof'20138,288,860'Memory device system with stacked packages'20128,242,607'Integrated circuit package system with offset stacked die and method of manufacture thereof'20128,138,017'Integrated circuit package system with through semiconductor vias and method of manufacture thereof'20128,037,918'Pick-up heads and systems for die bonding and related applications'20117,989,941'Integrated circuit package system with support structure for die overhang'20117,867,821'Integrated circuit package system with through semiconductor vias and method of manufacture thereof'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2015Patents assigned to STATS CHIPPAC LTD (8)· patent assignee history
2011–2019Based in Shanghai, CN· patent location history
2011–2013Based in Hsin Chu Hsien, TW· patent location history
2012–2015Patents assigned to CHIN CHEE KEONG (6)· patent assignee history
2012–2015Patents assigned to FENG YU FENG (3)· patent assignee history
2012Patents assigned to QU WEN BIN (1)· patent assignee history
2014Based in Butterworth, MY· patent location history
2018–2019Patents assigned to SANDISK SEMICONDUCTOR SHANGHAI CO LTD (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 8 | 2011–2015 |
| CHIN CHEE KEONGself | 6 | 2012–2015 |
| SANDISK SEMICONDUCTOR SHANGHAI CO LTD | 4 | 2018–2019 |
| FENG YU FENG | 3 | 2012–2015 |
| QU WEN BIN | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shanghai, CN | 9 | 2011–2019 |
| Hsin Chu Hsien, TW | 3 | 2011–2013 |
| Butterworth, MY | 1 | 2014 |