LexDanaLexDanabeta
Inventor

Man BAO

Inventor
CN

Overview

2→
Patents
2024–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,550,727Elastic heat spreader for chip package, package structure and packaging method202612,033,955Electromagnetic shielding package structure comprising electroplating layer and package method thereof2024

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024Patents assigned to JCET GROUP CO LTD (1)· patent assignee history
2024–2026Based in CN· patent location history
2026Patents assigned to STATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
JCET GROUP CO LTD12024
STATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD12026
Locations
LocationPatentsSpan
CN22024–2026