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Inventor

Chia-Shen Cheng

Inventor
Hsinchu County, TW

Overview

4→
Patents
2020–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
G01NInvestigating or analysing materials by determining their chemical or physical properties8%
G02BOptical elements, systems or apparatus8%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers8%
H05KPrinted circuits8%
PatentTitleYear
11,002,927Package structure202110,978,370Integrated fan-out packages with embedded heat dissipation structure202110,903,090Method of singulate a package structure using a light transmitting film on a polymer layer202110,571,430Gas concentration sensors and systems2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020Patents assigned to VEECO INSTR INC (1)· patent assignee history
2020Based in Somerset, NJ, US· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2021Based in Hsinchu County, TW· patent location history
2021Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32021
VEECO INSTR INC12020
Locations
LocationPatentsSpan
Hsinchu County, TW22021
Hsinchu, TW12021
Somerset, New Jersey, US12020