Inventor
Akira Takaishi
Inventor
Okayama, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G05Dprimary
G05DSystems for controlling or regulating non-electric variables23%
G05BControl or regulating systems in general15%
B29CShaping or joining of plastics8%
B65BMachines, apparatus or devices for, or methods of, packaging articles or materials8%
C03BManufacture, shaping, or supplementary processes8%
F27BFurnaces, kilns, ovens or retorts in general8%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace8%
G01KMeasuring temperature8%
H01RElectrically-conductive connections8%
H05KPrinted circuits8%
PatentTitleYear
10,442,139Seal bar and heat sealing apparatus20197,548,796'Method, apparatus, and program for controlling temperature within a heating system'20097,231,540'Method of identifying connection error and electronic apparatus using same'20077,031,168'Electronic component and the method of using it'20066,951,998'Controller, temperature regulator and heat treatment apparatus'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2019Patents assigned to OMRON TATEISI ELECTRONICS CO (5)· patent assignee history
2005Based in Kyoto, JP· patent location history
2006–2009Based in Okayama, JP· patent location history
2019Based in Moriyama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| OMRON TATEISI ELECTRONICS CO | 5 | 2005–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Okayama, JP | 3 | 2006–2009 |
| Moriyama, JP | 1 | 2019 |
| Kyoto, JP | 1 | 2005 |