Inventor
Matthew David Romig
Inventor
Richardson, TX, US
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H05KPrinted circuits7%
H10DInorganic electric semiconductor devices7%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems4%
H03HImpedance networks, e.g. resonant circuits4%
B29CShaping or joining of plastics2%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering2%
B41MPrinting, duplicating, marking, or copying processes2%
PatentTitleYear
11,082,0283D-printed protective shell structures with support columns for stress sensitive circuits202111,061,384Methods, apparatus, and systems to facilitate multi-channel isolation202111,049,836Bond wire support systems and methods202110,756,013Packaged semiconductor system having unidirectional connections to discrete components202010,566,276Packaged semiconductor system having unidirectional connections to discrete components202010,516,3813D-printed protective shell structures for stress sensitive circuits20199,899,339'Discrete device mounted on substrate'20189,852,979Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips20179,842,797'Stacked die power converter'20179,780,017'Packaged device with additive substrate surface modification'20179,768,130'Integrated power package'20179,679,864'Printed interconnects for semiconductor packages'20179,647,329'Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide'20179,572,261'Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips'20179,527,728'Integrated circuit package and method'20169,524,926'Packaged device with additive substrate surface modification'20169,496,171'Printed interconnects for semiconductor packages'20169,111,845'Integrated circuit package with printed circuit layer'20158,945,986'Electronic assembly with three dimensional inkjet printed traces'20158,847,349'Integrated circuit package with printed circuit layer'20148,816,513'Electronic assembly with three dimensional inkjet printed traces'20148,723,337'Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate'20148,716,068'Method for contacting agglomerate terminals of semiconductor packages'20148,643,165'Semiconductor device having agglomerate terminals'20148,298,870'Method for connecting integrated circuit chip to power and ground circuits'20128,299,588'Structure and method for uniform current distribution in power supply module'20127,863,738'Apparatus for connecting integrated circuit chip to power and ground circuits'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2021Patents assigned to TEXAS INSTRUMENTS INC (27)· patent assignee history
2011–2018Based in Richardson, TX, US· patent location history
2012–2014Patents assigned to ROMIG MATTHEW D (4)· patent assignee history
2014Patents assigned to EDWARDS DARVIN R (1)· patent assignee history
2014Patents assigned to GURRUM SIVA PRAKASH (1)· patent assignee history
2014Patents assigned to HAYATA KAZUNORI (1)· patent assignee history
2016–2021Based in Wylie, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 27 | 2011–2021 |
| ROMIG MATTHEW Dself | 4 | 2012–2014 |
| EDWARDS DARVIN R | 1 | 2014 |
| GURRUM SIVA PRAKASH | 1 | 2014 |
| HAYATA KAZUNORI | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Richardson, Texas, US | 14 | 2011–2018 |
| Wylie, Texas, US | 13 | 2016–2021 |