Inventor
Seon Goo Lee
Inventor
Kyungki-do, KR
Overview
Patents· 47 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H10HInorganic light-emitting semiconductor devices having potential barriers26%
H05KPrinted circuits5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
LOC133%
B01DSeparation2%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
C02FTreatment of water, waste water, sewage, or sludge2%
C09KMaterials for miscellaneous applications, not provided for elsewhere2%
E03FSewers2%
PatentTitleYear
11,084,801Benzodiazepine derivatives and uses thereof2021RE046851High power light emitting diode package2018RE045596'High power light emitting diode package'2015RE044811'High power light emitting diode package'20148,324,646'Chip coated light emitting diode package and manufacturing method thereof'20128,202,746'Method of manufacturing LED package for formation of molding member'20128,169,128'LED package having recess in heat conducting part'2012RE043200'High power light emitting diode package'20128,105,854'LED package'20128,013,352'Chip coated light emitting diode package and manufacturing method thereof'20117,903,410'Package board and method for manufacturing thereof'20117,875,476'High power LED package and fabrication method thereof'20117,846,752'High power LED housing and fabrication method thereof'20107,833,811'Side-emitting LED package and method of manufacturing the same'20107,795,052'Chip coated light emitting diode package and manufacturing method thereof'20107,790,482'Light emitting diode package with diffuser and method of manufacturing the same'20107,714,342'Chip coated light emitting diode package and manufacturing method thereof'20107,687,292'Light emitting diode package with metal reflective layer and method of manufacturing the same'20107,683,470'LED package'20107,678,592'LED housing and fabrication method thereof'20107,663,199'High power light emitting diode package and fabrication method thereof'20107,626,250'High power LED package and fabrication method thereof'20097,566,912'Light emitting diode package'20097,560,057'Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method'20097,501,656'Light emitting diode package with diffuser and method of manufacturing the same'20097,498,610'High power LED housing and fabrication method thereof'20097,462,871'Side-view light emitting diode having protective device'20087,458,703'Light emitting diode package having dual lens structure for lateral light emission'2008D0568261'Light-emitting diode'20087,338,823'Side-emitting LED package and manufacturing method of the same'2008RE040112'Semiconductor package and method for fabricating the same'20087,211,900'Thin semiconductor package including stacked dies'20077,208,772'High power light emitting diode package'20077,190,071'Semiconductor package and method for fabricating the same'20077,156,538'LED package for backlight unit'20077,157,029'Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method'20076,995,448'Semiconductor package including passive elements and method of manufacture'20066,982,485'Stacking structure for semiconductor chips and a semiconductor package using it'2006D0512694'Light-emitting diode'2005D0512029'Light-emitting diode'20056,936,922'Semiconductor package structure reducing warpage and manufacturing method thereof'20056,798,049'Semiconductor package and method for fabricating the same'20046,717,248'Semiconductor package and method for fabricating the same'20046,515,356'Semiconductor package and method for fabricating the same'20036,469,258'Circuit board for semiconductor package'20026,303,997'Thin, stackable semiconductor packages'20015,986,334'Semiconductor package having light, thin, simple and compact structure'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2008Patents assigned to AMKOR TECHNOLOGY INC (12)· patent assignee history
1999–2007Based in Seoul, KR· patent location history
2002–2007Based in Kyonggi-do, KR· patent location history
2003–2018Based in Kyungki-do, KR· patent location history
2005–2011Patents assigned to SAMSUNG ELECTRO MECH (21)· patent assignee history
2010–2012Patents assigned to SAMSUNG LED CO LTD (9)· patent assignee history
2012–2015Patents assigned to LEE SEON GOO (7)· patent assignee history
2012–2014Patents assigned to HAN KYUNG TAEG (4)· patent assignee history
2012Based in Gyeonggi-do, KR· patent location history
2021Based in Daejeon, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRO MECH | 21 | 2005–2011 |
| AMKOR TECHNOLOGY INC | 12 | 1999–2008 |
| SAMSUNG LED CO LTD | 9 | 2010–2012 |
| LEE SEON GOOself | 7 | 2012–2015 |
| HAN KYUNG TAEG | 4 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyungki-do, KR | 34 | 2003–2018 |
| Kyonggi-do, KR | 5 | 2002–2007 |
| Seoul, KR | 4 | 1999–2007 |
| Daejeon, KR | 1 | 2021 |
| Gyeonggi-do, KR | 1 | 2012 |