Inventor
Dennis Buese
Inventor
O'Fallon, MO, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing63%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
B24DTools for grinding, buffing or sharpening13%
PatentTitleYear
7,846,006'Dressing a wafer polishing pad'20107,846,007'System and method for dressing a wafer polishing pad'20106,479,386'Process for reducing surface variations for polished wafer'20026,398,631'Method and apparatus to place wafers into and out of machine'20026,257,954'Apparatus and process for high temperature wafer edge polishing'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2010Patents assigned to MEMC ELECTRONIC MATERIALS (5)· patent assignee history
2001–2010Based in O'Fallon, MO, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEMC ELECTRONIC MATERIALS | 5 | 2001–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| O'Fallon, MO, US | 5 | 2001–2010 |