Inventor
Michael Newman
Inventor
Fort Collins, CO, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H01LSemiconductor devices26%
H05KPrinted circuits12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
Y10TTechnical subjects covered by former us classification8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
G06FElectric digital data processing3%
A61NElectrotherapy1%
G02BOptical elements, systems or apparatus1%
G06NComputing arrangements based on specific computational models1%
PatentTitleYear
11,100,892Display element, system, and method202111,093,669Method and system for quantum computing202110,744,320Magnetic field detector for implantable medical devices202010,475,733Method and structures for heat dissipating interposers201910,403,510Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate201910,396,114Method of fabricating low CTE interposer without TSV structure201910,297,582BVA interposer201910,181,411Method for fabricating a carrier-less silicon interposer201910,103,094Method and structures for heat dissipating interposers20189,893,030'Reliable device assembly'20189,691,693'Carrier-less silicon interposer using photo patterned polymer as substrate'20179,685,401'Structures for heat dissipating interposers'20179,558,964'Method of fabricating low CTE interposer without TSV structure'20179,502,390'BVA interposer'20169,398,700'Method of forming a reliable microelectronic assembly'20169,379,008'Metal PVD-free conducting structures'20169,355,905'Methods and structure for carrier-less thin wafer handling'20169,312,175'Surface modified TSV structure and methods thereof'20169,237,648'Carrier-less silicon interposer'20169,123,780'Method and structures for heat dissipating interposers'20159,064,933'Methods and structure for carrier-less thin wafer handling'20158,981,564'Metal PVD-free conducting structures'20158,884,427'Low CTE interposer without TSV structure'20147,592,697'Microelectronic package and method of cooling same'20097,528,006'Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion'20097,402,515'Method of forming through-silicon vias with stress buffer collars and resulting devices'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2009Patents assigned to INTEL CORP (3)· patent assignee history
2008–2009Based in Gilbert, AZ, US· patent location history
2014–2019Patents assigned to INVENSAS CORP (20)· patent assignee history
2014–2020Based in Dublin, CA, US· patent location history
2016–2019Based in Fort Collins, CO, US· patent location history
2020Patents assigned to MEDTRONIC INC (1)· patent assignee history
2020Patents assigned to NEWMAN MICHAEL W (1)· patent assignee history
2021Patents assigned to ALIBABA GROUP HOLDING LTD (1)· patent assignee history
2021Based in Portland, OR, US· patent location history
2021Based in Sunnyvale, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INVENSAS CORP | 20 | 2014–2019 |
| INTEL CORP | 3 | 2008–2009 |
| ALIBABA GROUP HOLDING LTD | 1 | 2021 |
| MEDTRONIC INC | 1 | 2020 |
| NEWMAN MICHAEL Wself | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fort Collins, CO, US | 12 | 2016–2019 |
| Dublin, California, US | 9 | 2014–2020 |
| Gilbert, AZ, US | 2 | 2008–2009 |
| Portland, OR, US | 1 | 2021 |
| Sunnyvale, California, US | 1 | 2021 |