Inventor
TAKESHI SUNAGA
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds10%
C08LCompositions of macromolecular compounds10%
C09DCoating compositions, e.g. paints, varnishes or lacquers10%
C09JAdhesives10%
PatentTitleYear
12,283,566Semiconductor device and method for manufacturing the same202511,735,561Semiconductor device and method for manufacturing semiconductor device202311,535,715Siloxane-imide copolymer and addition curable composition comprising same202211,367,704Semiconductor device and method for manufacturing semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to ROHM CO LTD (3)· patent assignee history
2022Patents assigned to MOMENTIVE PERFORMANCE MAT INC (1)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ROHM CO LTD | 3 | 2022–2025 |
| MOMENTIVE PERFORMANCE MAT INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2025 |