Inventor

Lu-Ming Lai

Inventor

Kaohsiung, TW

Overview

17→

Patents

2011–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%

H01LSemiconductor devices18%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation12%

H10HInorganic light-emitting semiconductor devices having potential barriers12%

B81BMicrostructural devices or systems, e.g. micromechanical devices8%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems5%

H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light5%

G01CMeasuring distances, levels or bearings3%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%

G02BOptical elements, systems or apparatus3%

PatentTitleYear

10,862,014Optical device package and method of manufacturing the same2020 10,841,679Microelectromechanical systems package structure2020 10,818,816Optical device with decreased interference2020 10,812,017Semiconductor package structure2020 10,782,184Optical device and method of manufacturing the same2020 10,752,494Semiconductor device package2020 10,720,751Optical package structure, optical module, and method for manufacturing the same2020 10,689,249Semiconductor device package including a wall and a grounding ring exposed from the wall2020 10,665,765Semiconductor device package and a method of manufacturing the same2020 10,629,787Lid and an optical device package having the same2020 10,508,910Optical module and method of making the same2019 10,436,635Active optical component with passive optical component and encapsulant for an optical device and electrical device including the same2019 10,170,658Semiconductor package structures and method of manufacturing the same2019 10,069,051Semiconductor package device and method of manufacturing the same2018 9,977,147Optical module, method of making the same and electronic device including the same2018 9,711,473'Semiconductor die, semiconductor wafer and method for manufacturing the same'2017 8,056,247'Tilt sensor'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011Patents assigned to EVERLIGHT ELECTRONICS CO LTD (1)· patent assignee history

2011Patents assigned to LAI LU-MING (1)· patent assignee history

2011Based in Taipei, TW· patent location history

2017–2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (16)· patent assignee history

2017–2020Based in Kaohsiung, TW· patent location history

2020Patents assigned to ADVANCED SEMICONDUCTORY ENGINEERING INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ADVANCED SEMICONDUCTOR ENG	16	2017–2020
ADVANCED SEMICONDUCTORY ENGINEERING INC	1	2020
EVERLIGHT ELECTRONICS CO LTD	1	2011
LAI LU-MINGself	1	2011

Locations

Location	Patents	Span
Kaohsiung, TW	16	2017–2020
Taipei, TW	1	2011