Inventor
WILLIAM LAMBERT
Inventor
FR
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties17%
G01SRadio direction-finding15%
A61BDiagnosis14%
G10KSound-producing devices6%
H01LSemiconductor devices6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material3%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes3%
G16HHealthcare informatics, i.e. information and communication technology [ict] specially adapted for the handling or processing of medical or healthcare data3%
H01FMagnets3%
PatentTitleYear
12,551,189Method and system for characterising a medium using ultrasound202612,529,682Method and system for ultrasonic characterization of a medium202612,259,502Method and system for processing beamformed data202512,257,103Method and system for non-invasively characterizing a heterogeneous medium using ultrasound202512,153,131Method and system for ultrasonic characterization of a medium202412,087,682Power delivery structures202412,064,803Systems and methods to facilitate hose and fitting identification and assembly202412,000,154Interlocking tile202411,977,189Method and system for processing beamformed data preliminary class2024D1016336Flooring tile having drainage holes202411,833,568Systems and methods to facilitate hose and fitting identification and assembly202311,776,526Method and system for ultrasonic characterization of a medium202311,767,302Reagents and methods for tetrazine synthesis202311,768,181Method and system for ultrasonic characterization of a medium202311,761,928Method and system for ultrasonic characterization of a medium202311,676,950Via-in-via structure for high density package integrated inductor202311,611,164Wideband multi-pin edge connector for radio frequency front end module202311,408,723Method and systems for the non-invasive optical characterization of a heterogeneous medium202211,380,652Multi-level distributed clamps202211,346,819Methods and systems for non-invasively characterizing a heterogeneous medium using ultrasound202211,335,620Package inductor having thermal solution structures202211,215,662Method, device and system to protect circuitry during a burn-in process2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to ECOLE SUPERIEURE PHYSIQUE & CHIMIE IND VILLE DE PARIS (9)· patent assignee history
2022–2024Patents assigned to INTEL CORP (6)· patent assignee history
2022–2025Patents assigned to CENTRE NAT RECH SCIENT (4)· patent assignee history
2022–2026Based in FR· patent location history
2022–2024Based in US· patent location history
2023–2026Patents assigned to SUPERSONIC IMAGINE (9)· patent assignee history
2023–2026Patents assigned to CENTRE NATIONAL DE LA RECH SCIENTIFIQUE—CNRS (7)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ECOLE SUPERIEURE PHYSIQUE & CHIMIE IND VILLE DE PARIS | 9 | 2022–2026 |
| SUPERSONIC IMAGINE | 9 | 2023–2026 |
| CENTRE NATIONAL DE LA RECH SCIENTIFIQUE—CNRS | 7 | 2023–2026 |
| INTEL CORP | 6 | 2022–2024 |
| CENTRE NAT RECH SCIENT | 4 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| FR | 11 | 2022–2026 |
| US | 11 | 2022–2024 |