Inventor
Hyun Soo Roh
Inventor
Gunpo-si, KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Gprimary
C09GPolishing compositions31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
C09KMaterials for miscellaneous applications, not provided for elsewhere15%
B24BMachines, devices, or processes for grinding or polishing8%
C01BNon-metallic elements8%
H01LSemiconductor devices8%
PatentTitleYear
8,828,266'CMP slurry composition and polishing method using the same'20147,601,273'Polishing slurry composition and method of using the same'20097,534,277'Slurry composition for secondary polishing of silicon wafer'20096,930,054'Slurry composition for use in chemical mechanical polishing of metal wiring'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
2005–2009Based in Gunpo-si, KR· patent location history
2009–2014Patents assigned to CHEIL IND INC (3)· patent assignee history
2009Patents assigned to MEMC KOREA CO LTD (1)· patent assignee history
2009Based in Kyungki-do, KR· patent location history
2014Based in Uiwang-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHEIL IND INC | 3 | 2009–2014 |
| MEMC KOREA CO LTD | 1 | 2009 |
| SAMSUNG ELECTRONICS CO LTD | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gunpo-si, KR | 2 | 2005–2009 |
| Uiwang-si, KR | 1 | 2014 |
| Kyungki-do, KR | 1 | 2009 |