Inventor
Diane Lai
Inventor
Corvallis, OR, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B41Jprimary
B41JTypewriters36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
B81BMicrostructural devices or systems, e.g. micromechanical devices18%
H05KPrinted circuits18%
PatentTitleYear
7,432,582'Method of forming a through-substrate interconnect'20086,902,872'Method of forming a through-substrate interconnect'20056,764,605'Particle tolerant architecture for feed holes and method of manufacturing'20046,716,737'Method of forming a through-substrate interconnect'20046,555,480'Substrate with fluidic channel and method of manufacturing'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2008Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (5)· patent assignee history
2003–2008Based in Corvallis, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD DEVELOPMENT CO | 5 | 2003–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Corvallis, OR, US | 5 | 2003–2008 |