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Inventor

Tiejun Dai

Inventor
Santa Clara, CA, US

Overview

63→
Patents
2004–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 63 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H04Nprimary
H04NPictorial communication, e.g. television43%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation24%
H01LSemiconductor devices16%
G01SRadio direction-finding5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
H03FAmplifiers3%
H10DInorganic electric semiconductor devices3%
A61BDiagnosis1%
G06FElectric digital data processing1%
H03MCoding1%
PatentTitleYear
11,102,422High-dynamic range image sensor and image-capture method202111,064,134High-dynamic range image sensor and image-capture method202110,834,351Bitline settling speed enhancement202010,630,922Local exposure sensor and method for operating the same202010,547,804Pixel readout structure and timing to provide fixed pattern noise reduction in image sensors202010,510,796Small pixels having dual conversion gain providing high dynamic range201910,375,338Two stage amplifier readout circuit in pixel level hybrid bond image sensors201910,263,031Feedback capacitor and method for readout of hybrid bonded image sensors201910,110,837Method and apparatus for data transmission in an image sensor201810,015,388Image sensor with fast intra-frame focus20189,961,279Blooming free high dynamic range image sensor read out architecture using in-frame multi-bit exposure control20189,961,292Imaging sensor with amplifier having variable bias and increased output signal range20189,955,091High dynamic range image sensor read out architecture using in-frame multi-bit exposure control20189,888,185'Row decoder for high dynamic range image sensor using in-frame multi-bit exposure control'20189,859,312'Feedback capacitor formed by bonding-via in pixel level bond'20189,819,930'Time of flight imaging with improved initiation signaling'20179,819,890'Readout circuitry to mitigate column fixed pattern noise of an image sensor'20179,720,076'Calibration circuitry and method for a time of flight imaging system'20179,658,336'Programmable current source for a time of flight 3D image sensor'20179,608,027'Stacked embedded SPAD image sensor for attached 3D information'20179,570,507'Entrenched transfer gate'20179,523,765'Pixel-level oversampling for a time of flight 3D image sensor with dual range measurements'20169,478,579'Stacked chip image sensor with light-sensitive circuit elements on the bottom chip'20169,462,179'Image sensor with fast intra-frame focus'20169,344,658'Negative biased substrate for pixels in stacked image sensors'20169,332,193'Synchronization of image acquisition in multiple image sensors with a synchronization clock signal'20169,319,613'Image sensor having NMOS source follower with P-type doping in polysilicon gate'20169,319,603'Shared terminal of an image sensor system for transferring image data and control signals'20169,313,476'Precharged latched pixel cell for a time of flight 3D image sensor'20169,305,968'Die seal ring for integrated circuit system with stacked device wafers'20169,299,732'Stacked chip SPAD image sensor'20169,247,162'System and method for digital correlated double sampling in an image sensor'20169,210,350'Low power imaging system with single photon avalanche diode photon counters and ghost image reduction'20159,177,983'Image sensor with optical filters having alternating polarization for 3D imaging'20159,148,596'Feed-forward technique for power supply rejection ratio improvement of bit line'20159,142,581'Die seal ring for integrated circuit system with stacked device wafers'20159,124,823'Image sensor with fast intra-frame focus'20159,119,544'Acquiring global shutter-type video images with CMOS pixel array by strobing light during vertical blanking period in otherwise dark environment'20159,118,851'High dynamic range image sensor read out architecture'20159,030,584'Image sensor with substrate noise isolation'20159,001,250'Method and apparatus for reading image data from an image sensor'20158,933,544'Integrated circuit stack with integrated electromagnetic interference shielding'20158,933,385'Hybrid analog-to-digital converter having multiple ADC modes'20158,916,980'Pad and circuit layout for semiconductor devices'20148,890,945'Shared terminal of an image sensor system for transferring image data and control signals'20148,810,670'Shared terminal of an image sensor system for transferring clock and control signals'20148,735,795'Image sensor with integrated ambient light detection'20148,730,364'Image sensor with pipelined column analog-to-digital converters'20148,581,174'Image sensor with prismatic de-multiplexing'20138,576,979'Arithmetic counter circuit, configuration and application for high performance CMOS image sensors'20138,487,350'Entrenched transfer gate'20138,299,513'High conversion gain image sensor'20128,248,490'Imaging sensor having reduced column fixed pattern noise'20128,228,411'Circuit and photo sensor overlap for backside illumination image sensor'20128,120,423'OP-AMP sharing with input and output reset'20128,101,978'Circuit and photo sensor overlap for backside illumination image sensor'20128,081,247'Partial row readout for image sensor'20117,995,124'Image sensor apparatus and method for improved dynamic range with multiple readout circuit paths'20117,847,834'Light source frequency detection circuit using bipolar transistor'20107,639,073'Switched-capacitor amplifier with improved reset phase'20097,605,359'Light source frequency detection circuit for image sensor'20097,193,198'Image sensor and pixel that has variable capacitance output or floating node'20076,734,413'Zero DC current readout circuit for CMOS image sensor using a precharge capacitor'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2021Patents assigned to OMNIVISION TECH INC (62)· patent assignee history
2004–2021Based in Santa Clara, CA, US· patent location history
2007–2011Based in Sunnyvale, CA, US· patent location history
2011–2015Patents assigned to DAI TIEJUN (17)· patent assignee history
2012–2013Patents assigned to NOZAKI HIDETOSHI (3)· patent assignee history
2012–2015Patents assigned to RHODES HOWARD E (3)· patent assignee history
2012–2015Patents assigned to TAI HSIN-CHIH (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
OMNIVISION TECH INC622004–2021
DAI TIEJUNself172011–2015
NOZAKI HIDETOSHI32012–2013
RHODES HOWARD E32012–2015
TAI HSIN-CHIH32012–2015
Locations
LocationPatentsSpan
Santa Clara, California, US582004–2021
Sunnyvale, California, US52007–2011