LexDanaLexDanabeta
Inventor

WEI-CHE HUANG

Inventor
TW

Overview

4→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10DInorganic electric semiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
12,237,401Semiconductor chip202511,728,292Semiconductor package assembly having a conductive electromagnetic shield layer202311,450,756Manufacturing method of semiconductor chip202211,348,900Package structure2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to MEDIATEK INC (4)· patent assignee history
2022–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MEDIATEK INC42022–2025
Locations
LocationPatentsSpan
TW42022–2025