Inventor

Sirish Reddy

Inventor
Hillsboro, OR, US

Overview

23→
Patents
2011–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H01LSemiconductor devices19%
C23CCoating metallic material18%
H10DInorganic electric semiconductor devices9%
H01JElectric discharge tubes or discharge lamps8%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H05HPlasma technique4%
H10BElectronic memory devices4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
Y10TTechnical subjects covered by former us classification2%
PatentTitleYear
10,831,096Vacuum-integrated hardmask processes and apparatus202010,514,598Vacuum-integrated hardmask processes and apparatus201910,242,848Carrier ring structure and chamber systems including the same201910,242,883High aspect ratio etch of oxide metal oxide metal stack201910,192,759Image reversal with AHM gap fill for multiple patterning20199,928,994'Methods for decreasing carbon-hydrogen content of amorphous carbon hardmask films'20189,875,890Deposition of metal dielectric film for hardmasks20189,778,561'Vacuum-integrated hardmask processes and apparatus'20179,659,783'High aspect ratio etch with combination mask'20179,637,821'Method for supplying vaporized precursor'20179,589,799'High selectivity and low stress carbon hardmask by pulsed low frequency RF power'20179,520,295'Metal doping of amorphous carbon and silicon films used as hardmasks in substrate processing systems'20169,362,133'Method for forming a mask by etching conformal film on patterned ashable hardmask'20169,337,068'Oxygen-containing ceramic hard masks and associated wet-cleans'20169,320,387'Sulfur doped carbon hard masks'20169,117,668'PECVD deposition of smooth silicon films'20159,023,731'Carbon deposition-etch-ash gap fill process'20159,018,103'High aspect ratio etch with combination mask'20158,628,618'Precursor vapor generation and delivery system with filters and filter monitoring system'20148,512,818'Cascaded cure approach to fabricate highly tensile silicon nitride films'20138,362,571'High compressive stress carbon liners for MOS devices'20138,211,510'Cascaded cure approach to fabricate highly tensile silicon nitride films'20127,906,817'High compressive stress carbon liners for MOS devices'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011–2015Patents assigned to NOVELLUS SYSTEMS INC (7)· patent assignee history
2011–2019Based in Hillsboro, OR, US· patent location history
2012–2013Patents assigned to SIMS JAMES S (3)· patent assignee history
2012–2013Patents assigned to JIANG GENGWEI (2)· patent assignee history
2013–2015Patents assigned to REDDY SIRISH (3)· patent assignee history
2015–2020Patents assigned to LAM RES CORP (16)· patent assignee history
2019–2020Based in Portland, OR, US· patent location history
2019Based in Tualatin, OR, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LAM RES CORP162015–2020
NOVELLUS SYSTEMS INC72011–2015
REDDY SIRISHself32013–2015
SIMS JAMES S32012–2013
JIANG GENGWEI22012–2013
Locations
LocationPatentsSpan
Hillsboro, OR, US192011–2019
Portland, OR, US32019–2020
Tualatin, OR, US12019