LexDanaLexDanabeta
Inventor

Kazuya Kitazawa

Inventor
Saitama, JP

Overview

3→
Patents
2018–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering33%
B05CApparatus for applying fluent materials to surfaces, in general11%
B05DProcesses for applying fluent materials to surfaces, in general11%
C22CAlloys11%
H01LSemiconductor devices11%
H05KPrinted circuits11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
PatentTitleYear
10,632,492Fluid discharge device, fluid discharge method, and fluid application device202010,160,064Flux, solder paste and solder joint20189,902,022'Flux and solder paste'2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2020Patents assigned to SENJU METAL INDUSTRY CO (3)· patent assignee history
2018Based in Saitama, JP· patent location history
2020Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SENJU METAL INDUSTRY CO32018–2020
Locations
LocationPatentsSpan
Saitama, JP22018
Tokyo, JP12020