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Inventor

Aja Hartman

Inventor
Palo Alto, CA, US

Overview

4→
Patents
2018–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics25%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering25%
LOC1425%
B23KSoldering or unsoldering13%
G01NInvestigating or analysing materials by determining their chemical or physical properties13%
PatentTitleYear
11,104,069Finishing a 3D printed object202111,072,123Deviant control in additive manufacturing2021D0893447Wireless bodypack2020D0808356'Transmitter housing'2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2020Patents assigned to SHURE ACQUISITION HOLDINGS INC (2)· patent assignee history
2018–2020Based in Chicago, IL, US· patent location history
2021Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history
2021Based in Palo Alto, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO22021
SHURE ACQUISITION HOLDINGS INC22018–2020
Locations
LocationPatentsSpan
Palo Alto, California, US22021
Chicago, Illinois, US22018–2020