Inventor

Mirko Hattass

Inventor
Stuttgart, DE

Overview

33→
Patents
2013–2021
Patent span
Physics
Primary field (CPC G)

Patents· 33 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices20%
G01CMeasuring distances, levels or bearings19%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock12%
G02BOptical elements, systems or apparatus6%
H01LSemiconductor devices6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
G01DMeasuring not specially adapted for a specific variable3%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%
H10NElectric solid-state devices not otherwise provided for3%
PatentTitleYear
10,996,083Sensor system for attaching a sensor set-up to a vehicle202110,753,742Micromechanical yaw rate sensor and method for operating same202010,753,743Micromechanical yaw rate sensor and method for the production thereof202010,704,909MEMS rotation rate sensor including combined driving and detection202010,655,965Rotational speed sensor with minimized interference movements in the driving mode202010,627,617Micromechanical constituent and method for adjusting an adjustable element202010,557,710Dual-axis ultra-robust rotation rate sensor for automotive applications202010,502,569Rotation rate sensor and method201910,488,650Micromechanical component and method for adjusting an adjustable part simultaneously about two axes of rotation inclined in relation to one another201910,260,879Sensor device and method for operating a sensor device having at least one seismic mass201910,241,323Micromechanical device and method for the two-dimensional deflection of light201910,030,977Multiaxial rotation rate sensor including a split central rotor201810,017,376MEMS element including a stress decoupling structure and a component including such a MEMS element20189,945,669Rotation rate sensor and a method for operating a rotation rate sensor20189,835,645Acceleration sensor and method for producing an acceleration sensor20179,823,073'Rotation-rate sensor having a substrate having a main extension plane for detecting a rotation rate'20179,818,792'Infrared sensor device and method for producing an infrared sensor device'20179,791,275'Method for calibrating yaw rate sensors'20179,650,240'Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type'20179,434,606'Micromechanical inertial sensor and method for manufacturing same'20169,266,720'Hybrid integrated component'20169,233,841'Production process for a micromechanical component and micromechanical component'20169,212,048'Hybridly integrated component and method for the production thereof'20159,164,123'Micromechanical rotary acceleration sensor and method for detecting a rotary acceleration'20159,112,108'Energy source and method for supplying an autonomous electrical load system and the use of same'20158,955,380'Rotation rate sensor'20158,950,258'Micromechanical angular acceleration sensor and method for measuring an angular acceleration'20158,901,679'Micromechanical structure, in particular sensor arrangement, and corresponding operating method'20148,833,135'Sensor system and method for calibrating a sensor system'20148,836,053'Hybrid integrated component and method for the manufacture thereof'20148,711,459'Micromechanical component, device for beam deflection of monochromatic light, and spectrometer'20148,695,427'Micromechanical component having a test structure for determining the layer thickness of a spacer layer and method for manufacturing such a test structure'20148,461,833'Method for determining the sensitivity of an acceleration sensor or magnetic field sensor'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2021Patents assigned to BOSCH GMBH ROBERT (33)· patent assignee history
2013–2016Patents assigned to HATTASS MIRKO (10)· patent assignee history
2013–2016Patents assigned to FRANKE AXEL (4)· patent assignee history
2013–2016Patents assigned to CLASSEN JOHANNES (3)· patent assignee history
2013–2021Based in Stuttgart, DE· patent location history
2015–2016Patents assigned to MEISEL DANIEL CHRISTOPH (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
BOSCH GMBH ROBERT332013–2021
HATTASS MIRKOself102013–2016
FRANKE AXEL42013–2016
MEISEL DANIEL CHRISTOPH42015–2016
CLASSEN JOHANNES32013–2016
Locations
LocationPatentsSpan
Stuttgart, DE332013–2021