Inventor
Shuji Eguchi
Inventor
Ibaraki, JP
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H05KPrinted circuits12%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
G02BOptical elements, systems or apparatus8%
Y10TTechnical subjects covered by former us classification8%
B26BHand-held cutting tools not otherwise provided for3%
H01RElectrically-conductive connections3%
B01DSeparation2%
B29CShaping or joining of plastics2%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
7,924,572'Control device and method of manufacturing thereof'20117,554,039'Electronic device'20097,530,819'Device for controlling a vehicle'20097,445,455'Electronic device'20087,359,212'Control device and method of manufacturing thereof'20087,303,406'Device for controlling a vehicle'20077,217,992'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'20077,202,570'Circuit tape having adhesive film semiconductor device and a method for manufacturing the same'20077,091,620'Semiconductor device and manufacturing method thereof'20067,038,325'Wiring tape for semiconductor device including a buffer layer having interconnected foams'20067,018,218'Device for controlling a vehicle'20066,940,162'Semiconductor module and mounting method for same'20056,888,230'Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device'20056,861,294'Semiconductor devices and methods of making the devices'20056,791,194'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'20046,784,541'Semiconductor module and mounting method for same'20046,686,226'Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame'20046,639,323'Semiconductor device and its manufacturing method'20036,627,997'Semiconductor module and method of mounting'20036,586,105'Packaging structure and method for automotive components'20036,515,371'Semiconductor device with elastic structure and wiring'20036,433,440'Semiconductor device having a porous buffer layer for semiconductor device'20026,423,571'Method of making a semiconductor device having a stress relieving mechanism'20026,371,664'Photoelectronic device and method of manufacturing the same'20026,307,269'Semiconductor device with chip size package'20016,297,073'Semiconductor device'20016,282,350'Photoelectronic device and method of manufacturing the same'20016,130,112'Semiconductor device'20006,114,005'Laminate and multilayer printed circuit board'20006,114,192'Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame'20006,114,753'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'20006,097,100'Resin sealed semiconductor devices and a process for manufacturing the same'20006,049,128'Semiconductor device'20006,028,364'Semiconductor device having a stress relieving mechanism'20005,914,531'Semiconductor device having a ball grid array package structure using a supporting frame'19995,677,045'Laminate and multilayer printed circuit board'19975,602,420'Stacked high mounting density semiconductor devices'19975,145,579'Method of manufacturing a separation column'19925,113,477'Plastic optical fibers from polymers derived from metallic salts of ethylenic carboxyl monomers'19925,082,559'Glass chromatography capillary with relatively thick coating'19924,946,242'Optical part including integral combination of optical fiber and light emitting or receiving element and method of manufacturing the same'19904,873,030'Method of molding a resinous optical transmitting element'19894,810,048'Mechanical part mounting chassis with integrated circuit'19894,585,841'Transparent resin material containing metallic atoms bonded to pendent carboxylic acid groups'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2011Patents assigned to HITACHI LTD (33)· patent assignee history
1986–1992Based in Hitachi, JP· patent location history
1989–2007Patents assigned to HITACHI CABLE (6)· patent assignee history
1997–2006Based in Ibaraki, JP· patent location history
2000–2007Based in Tokai, JP· patent location history
2000–2006Based in Yawara-mura, JP· patent location history
2001–2003Patents assigned to AKITA ELECTRONICS CO LTD (3)· patent assignee history
2004–2007Patents assigned to RENESAS TECH CORP (7)· patent assignee history
2006–2009Patents assigned to HITACHI CAR ENG CO LTD (3)· patent assignee history
2008–2011Based in Kamagaya, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 33 | 1986–2011 |
| RENESAS TECH CORP | 7 | 2004–2007 |
| HITACHI CABLE | 6 | 1989–2007 |
| AKITA ELECTRONICS CO LTD | 3 | 2001–2003 |
| HITACHI CAR ENG CO LTD | 3 | 2006–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 12 | 1997–2006 |
| Tokai, JP | 8 | 2000–2007 |
| Yawara-mura, JP | 8 | 2000–2006 |
| Hitachi, JP | 7 | 1986–1992 |
| Kamagaya, JP | 3 | 2008–2011 |