Inventor
Hidenobu Nishikawa
Inventor
Nara, JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H05KPrinted circuits22%
Y10TTechnical subjects covered by former us classification18%
G06KGraphical data reading14%
H01QAntennas, i.e. radio aerials6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
B05CApparatus for applying fluent materials to surfaces, in general2%
B23KSoldering or unsoldering2%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
PatentTitleYear
8,866,021'Circuit board and process for producing the same'20148,599,571'Memory card'20138,291,582'Circuit board and process for producing the same'20128,223,500'Memory card and method for manufacturing the same'20128,125,786'Memory card'20128,035,225'Semiconductor chip assembly and fabrication method therefor'20118,031,127'Semiconductor memory module incorporating antenna'20118,007,627'Electronic component mounting method and apparatus'20117,939,923'Memory card and method for manufacturing memory card'20117,933,127'Memory card and memory card manufacturing method'20117,910,406'Electronic circuit device and method for manufacturing same'20117,775,446'Card type information device and method for manufacturing same'20107,683,482'Electronic component unit'20107,471,260'Semiconductor memory module having built-in antenna'20087,355,126'Electronic parts packaging method and electronic parts package'20087,076,867'Pressurizing method'20067,060,528'Method for mounting a semiconductor element to an interposer by compression bonding'20066,926,796'Electronic parts mounting method and device therefor'20056,770,320'Apparatus and method for applying fluid'20046,561,408'Bonding head and component mounting apparatus'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (6)· patent assignee history
2003–2008Based in Ikoma, JP· patent location history
2005–2011Based in Kadoma, JP· patent location history
2008–2014Patents assigned to PANASONIC CORP (14)· patent assignee history
2008–2014Based in Nara, JP· patent location history
2012–2014Patents assigned to NISHIKAWA HIDENOBU (5)· patent assignee history
2012–2014Patents assigned to KOMYOJI DAIDO (4)· patent assignee history
2012–2013Patents assigned to TAKEDA SHUICHI (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC CORP | 14 | 2008–2014 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 6 | 2003–2008 |
| NISHIKAWA HIDENOBUself | 5 | 2012–2014 |
| KOMYOJI DAIDO | 4 | 2012–2014 |
| TAKEDA SHUICHI | 3 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nara, JP | 12 | 2008–2014 |
| Ikoma, JP | 5 | 2003–2008 |
| Kadoma, JP | 3 | 2005–2011 |