Inventor
Jeong-O Ha
Inventor
Asan-si, KR
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1058%
G05BControl or regulating systems in general17%
H01LSemiconductor devices17%
H05KPrinted circuits8%
PatentTitleYear
9,171,827'Stack type semiconductor package'20158,817,486'Semiconductor package having multi pitch ball land'20148,400,779'Semiconductor package having multi pitch ball land'20137,776,650'Method for fabricating a flip chip system in package'20107,723,836'Chip stack structure having shielding capability and system-in-package module using the same'20107,541,680'Semiconductor device package'20097,517,723'Method for fabricating a flip chip system in package'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2015Patents assigned to SAMSUNG ELECTRONICS CO LTD (7)· patent assignee history
2009–2010Based in Asan-si, KR· patent location history
2013–2015Patents assigned to HA JEONG-OH (3)· patent assignee history
2013–2014Patents assigned to KIM HYUN-A (2)· patent assignee history
2013–2014Patents assigned to KIM TONG-SUK (2)· patent assignee history
2013–2014Patents assigned to KWON HEUNG-KYU (2)· patent assignee history
2013–2015Based in Hwaseong-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 7 | 2009–2015 |
| HA JEONG-OHself | 3 | 2013–2015 |
| KIM HYUN-A | 2 | 2013–2014 |
| KIM TONG-SUK | 2 | 2013–2014 |
| KWON HEUNG-KYU | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Asan-si, KR | 4 | 2009–2010 |
| Hwaseong-si, KR | 3 | 2013–2015 |