Inventor
Ryuji Koga
Inventor
Omuta, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H01LSemiconductor devices17%
H05KPrinted circuits17%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
C04BLime, magnesia8%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients8%
C08LCompositions of macromolecular compounds8%
H01JElectric discharge tubes or discharge lamps8%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992Patents assigned to NIPPON STEEL CORP (1)· patent assignee history
1992Based in Kitakyushu, JP· patent location history
2002Patents assigned to KYOCERA CORP (1)· patent assignee history
2002Based in Okayama, JP· patent location history
2020–2021Patents assigned to DENKA COMPANY LTD (2)· patent assignee history
2020–2021Based in Omuta, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DENKA COMPANY LTD | 2 | 2020–2021 |
| KYOCERA CORP | 1 | 2002 |
| NIPPON STEEL CORP | 1 | 1992 |
Locations
| Location | Patents | Span |
|---|---|---|
| Omuta, JP | 2 | 2020–2021 |
| Okayama, JP | 1 | 2002 |
| Kitakyushu, JP | 1 | 1992 |