Inventor
John H. Lau
Inventor
Taipei, TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H01LSemiconductor devices8%
H05KPrinted circuits8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H05GX-ray technique5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
B05BSpraying apparatus3%
B23KSoldering or unsoldering3%
PatentTitleYear
9,583,366'Thermally-enhanced provision of underfill to electronic devices using a stencil'20179,385,056'Packaging substrate having embedded interposer and fabrication method thereof'20169,252,054'Thinned integrated circuit device and manufacturing process for the same'20168,674,491'Semiconductor device'20148,673,658'Fabricating method of semiconductor device'20148,536,701'Electronic device packaging structure'20138,519,524'Chip stacking structure and fabricating method of the chip stacking structure'20138,502,224'Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor'20138,456,017'Filled through-silicon via with conductive composite material'20138,397,584'Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatus'20136,299,058'Positioning method for attaching a solder ball to an electrical connector and the connector using the same'20016,075,710'Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips'20006,057,601'Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate'20005,825,084'Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices'19984,752,946'Gas discharge derived annular plasma pinch x-ray source'19884,751,723'Multiple vacuum arc derived plasma pinch x-ray source'19884,142,089'Pulsed coaxial thermal plasma sprayer'1979Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1979–1988Patents assigned to CANADIAN PATENTS DEV (3)· patent assignee history
1979Based in Ottawa, CA· patent location history
1988Based in Gloucester, CA· patent location history
1998–2017Based in Palo Alto, CA, US· patent location history
2013–2016Patents assigned to IND TECH RES INST (9)· patent assignee history
2013–2014Patents assigned to LAU JOHN H (6)· patent assignee history
2013–2014Patents assigned to TAIN RA-MIN (6)· patent assignee history
2013–2014Patents assigned to DAI MING-JI (5)· patent assignee history
2013–2016Based in Taipei, TW· patent location history
2016Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 9 | 2013–2016 |
| LAU JOHN Hself | 6 | 2013–2014 |
| TAIN RA-MIN | 6 | 2013–2014 |
| DAI MING-JI | 5 | 2013–2014 |
| CANADIAN PATENTS DEV | 3 | 1979–1988 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 8 | 2013–2016 |
| Palo Alto, California, US | 5 | 1998–2017 |
| Gloucester, CA | 2 | 1988 |
| Hsinchu, TW | 1 | 2016 |
| Ottawa, CA | 1 | 1979 |