Inventor

Paul Greiff

Inventor
Wayland, MA, US

Overview

44→
Patents
1978–2019
Patent span
Physics
Primary field (CPC G)

Patents· 44 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Pprimary
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock24%
G01CMeasuring distances, levels or bearings18%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution11%
H02SGeneration of electric power by conversion of infrared radiation, visible light or ultraviolet light, e.g. using photovoltaic [pv] modules9%
B81BMicrostructural devices or systems, e.g. micromechanical devices7%
H01LSemiconductor devices6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
Y10TTechnical subjects covered by former us classification3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
PatentTitleYear
10,418,502Method and structure for multi-cell devices without physical isolation20199,755,095'Method and structure for multicell devices without physical isolation'20179,712,105'Lateral photovoltaic device for near field use'20179,349,891'Submicron gap thermophotovoltaic structure and fabrication method'20169,065,006'Lateral photovoltaic device for near field use'20158,822,813'Submicron gap thermophotovoltaic structure and method'20148,633,373'Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabrication method therefor'20148,450,598'Method and structure for providing a uniform micron/sub-micron gap separation within micro-gap thermophotovoltaic devices for the generation of electrical power'20138,076,569'Method and structure, using flexible membrane surfaces, for setting and/or maintaining a uniform micron/sub-micron gap separation between juxtaposed photosensitive and heat-supplying surfaces of photovoltaic chips and the like for the generation of electrical power'20117,977,135'Micron gap thermal photovoltaic device and method of making the same'20117,390,962'Micron gap thermal photovoltaic device and method of making the same'20087,356,922'Method of fabricating a rate gyroscope and accelerometer multisensor'20086,990,725'Fabrication approaches for the formation of planar inductors and transformers'20066,615,681'Hybrid wafer gyroscope'20036,230,567'Low thermal strain flexure support for a micromechanical device'20015,969,250'Micromechanical accelerometer having a peripherally suspended proof mass'19995,929,515'Gettering enclosure for a semiconductor device'19995,817,942'Capacitive in-plane accelerometer'19985,796,001'Monolithic micromechanical tuning fork angular rate sensor'19985,760,305'Monolithic micromechanical vibrating beam accelerometer with trimmable resonant frequency'19985,725,729'Process for micromechanical fabrication'19985,650,568'Gimballed vibrating wheel gyroscope having strain relief features'19975,646,348'Micromechanical sensor with a guard band electrode and fabrication technique therefor'19975,635,639'Micromechanical tuning fork angular rate sensor'19975,605,598'Monolithic micromechanical vibrating beam accelerometer with trimmable resonant frequency'19975,581,035'Micromechanical sensor with a guard band electrode'19965,555,765'Gimballed vibrating wheel gyroscope'19965,535,902'Gimballed vibrating wheel gyroscope'19965,515,724'Micromechanical gyroscopic transducer with improved drive and sense capabilities'19965,507,911'Monolithic micromechanical vibrating string accelerometer with trimmable resonant frequency'19965,505,084'Micromechanical tuning fork angular rate sensor'19965,408,877'Micromechanical gyroscopic transducer with improved drive and sense capabilities'19955,408,119'Monolithic micromechanical vibrating string accelerometer with trimmable resonant frequency'19955,331,852'Electromagnetic rebalanced micromechanical transducer'19945,216,490'Bridge electrodes for microelectromechanical devices'19935,195,371'Semiconductor chip transducer'19935,144,184'Micromechanical device with a trimmable resonant frequency structure and method of trimming same'19925,129,983'Method of fabrication of large area micromechanical devices'19925,126,812'Monolithic micromechanical accelerometer'19925,111,693'Motion restraints for micromechanical devices'19925,060,039'Permanent magnet force rebalance micro accelerometer'19915,016,072'Semiconductor chip gyroscopic transducer'19914,516,263'Spatially integral, video signal processor'19854,067,037'Transistor having high f.sub.t at low currents'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–2019Based in Wayland, MA, US· patent location history
1985–2011Patents assigned to DRAPER LAB CHARLES S (32)· patent assignee history
2006–2015Patents assigned to GREIFF PAUL (5)· patent assignee history
2011–2014Patents assigned to BROWN ERIC (3)· patent assignee history
2011–2014Patents assigned to DIMATTEO ROBERT (3)· patent assignee history
2013–2019Patents assigned to MTPV POWER CORP (8)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DRAPER LAB CHARLES S321985–2011
MTPV POWER CORP82013–2019
GREIFF PAULself52006–2015
BROWN ERIC32011–2014
DIMATTEO ROBERT32011–2014
Locations
LocationPatentsSpan
Wayland, Massachusetts, US441978–2019