LexDanaLexDanabeta
Inventor

Michael T. Boldman

Inventor
Murphy, TX, US

Overview

3→
Patents
1993–2000
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits17%
PatentTitleYear
6,015,083'Direct solder bumping of hard to solder substrate'20005,772,106'Printhead for liquid metals and method of use'19985,229,016'Method and apparatus for dispensing spherical-shaped quantities of liquid solder'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2000Patents assigned to MICROFAB TECH INC (3)· patent assignee history
1993Based in Garland, TX, US· patent location history
1998–2000Based in Murphy, TX, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICROFAB TECH INC31993–2000
Locations
LocationPatentsSpan
Murphy, Texas, US21998–2000
Garland, Texas, US11993