LexDanaLexDanabeta
Inventor

Che-Wei Hsu

Inventor
Hsinchu County, TW

Overview

67→
Patents
1998–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 67 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G06FElectric digital data processing8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H05KPrinted circuits7%
Y10TTechnical subjects covered by former us classification5%
B62JCycle saddles or seats5%
G11CStatic stores2%
H01QAntennas, i.e. radio aerials2%
C22CAlloys2%
PatentTitleYear
10,814,927Bicycle saddle assembly structure thereof202010,777,518Package structure and method of manufacturing the same202010,770,313Integrated fan-out package and manufacturing method thereof202010,734,323Package structures202010,672,728Integrated fan-out package202010,628,319Methods for caching and reading data to be programmed into a storage unit and apparatuses using the same202010,595,444Rotatable board configuration to improve cooling202010,503,600Flash memory devices and error-handling methods thereof201910,483,232Method for fabricating bump structures on chips with panel type process201910,475,752Semiconductor package structure and method of making the same201910,475,765Interposer substrate and method for manufacturing the same201910,414,454Distinguishing system for saddle contacting mode201910,412,482Loudspeaker apparatus201910,365,829Memory transaction-level modeling method and system201910,310,746Method, associated memory device and controller thereof for performing dynamic resource management201910,304,750Package structure and its fabrication method201910,300,972Bicycle seat201910,283,442Interposer substrate and method of fabricating the same201910,276,404Integrated fan-out package201910,269,841Sensor package and method of manufacturing the same201910,214,048Bicycle wheel201910,202,158Adjustable seat tube structure and bicycle201910,185,662Methods for reprogramming data and apparatuses using the same201910,170,709Platinum complex having carbene fragment, OLED using the same, and nitrogen-containing heterocyclic bidentate chelate having carbene unit201910,162,759Methods for caching and reading data to be programmed into a storage unit and apparatuses using the same201810,157,834Electronic apparatus201810,117,340Manufacturing method of package substrate with metal on conductive portions201810,088,868Portable electronic device for acustic imaging and operating method for the same201810,002,823Packaging substrate and method of fabricating the same20189,992,879Package substrate with metal on conductive portions and manufacturing method thereof20189,893,003'Package substrate and flip-chip package circuit including the same'20189,831,165'Interposer substrate and method of manufacturing the same'20179,831,217Method of fabricating package substrates20179,815,161'Backlash automatic detection system for machine tool and method using the same'20179,805,996'Substrate structure and manufacturing method thereof'20179,779,022'Methods for caching and reading data to be programmed into a storage unit and apparatuses using the same'20179,772,618'Cutting tool controller and method of controlling the same'20179,747,206'Methods for reprogramming data and apparatuses using the same'20179,676,434'Bicycle seat'20179,583,436'Package apparatus and manufacturing method thereof'20179,573,650'Hidden hydraulic structure of bike disc brake'20179,548,234'Package substrate and flip-chip package circuit including the same'20179,387,519'Dewaxing device'20169,377,163'Method of manufacturing a hydrogen storage device'20169,370,105'Package apparatus with multiple pillar layers'20169,338,900'Interposer substrate and method of fabricating the same'20169,265,146'Method for manufacturing a multi-layer circuit board'20169,214,437'Package method'20159,039,024'Bicycle seatpost'20159,015,936'Method for manufacturing IC substrate'20158,905,473'Seat adjusting module'20148,806,981'Handlebar assembly'20148,545,695'Water provisioning system for kitchen'20138,382,133'Foldable device for connecting a front fork to a handlebar of a bicycle'20138,267,470'Positioning device for mounting a seat on a seat tube of a bicycle'20128,180,307'Electric device'20128,163,267'Method of synthesizing magnesium-cobalt pentahydride'20128,040,087'Control devices and methods'20117,956,559'Motor driving device'20117,828,915'Method for making Mg-based intermetallic compound'20107,683,599'Voltage control circuits'20107,648,598'Manufacturing method for isothermal evaporation casting process'20107,567,127'Automatic-gain control circuit'20097,399,399'Method for manufacturing semiconductor package substrate'20085,986,646'Method and apparatus for finding the location of a pointing instrument on a tablet'19995,914,710'Cordless pointing instrument for graphics tablet'19995,844,548'Stable wireless pointing device for a tablet'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2019Based in Taipei, TW· patent location history
2012–2020Patents assigned to GIANT MFG CO LTD (12)· patent assignee history
2012–2014Patents assigned to HSU CHE-WEI (6)· patent assignee history
2012–2020Based in Taichung, TW· patent location history
2013–2019Based in Hsinchu County, TW· patent location history
2014–2020Based in New Taipei, TW· patent location history
2015–2019Patents assigned to PHOENIX PIONEER TECHNOLOGY CO LTD (15)· patent assignee history
2017–2020Patents assigned to SILICON MOTION INC (7)· patent assignee history
2018–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2018–2020Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PHOENIX PIONEER TECHNOLOGY CO LTD152015–2019
GIANT MFG CO LTD122012–2020
SILICON MOTION INC72017–2020
HSU CHE-WEIself62012–2014
TAIWAN SEMICONDUCTOR MFG CO LTD62018–2020
Locations
LocationPatentsSpan
Hsinchu County, TW172013–2019
New Taipei, TW122014–2020
Taichung, TW102012–2020
Kaohsiung, TW62018–2020
Taipei, TW41999–2019