Inventor
Yuichi Miyoshi
Inventor
Osaka, JP
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices15%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers15%
B29CShaping or joining of plastics8%
B29DProducing particular articles from plastics or from substances in a plastic state8%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems8%
B24BMachines, devices, or processes for grinding or polishing5%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts5%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%
G02BOptical elements, systems or apparatus5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
10,191,078Acceleration sensor20199,989,674Plastics optical component and method for manufacturing the same20189,409,168'Microfluidic device'20169,360,666'Plastics optical component and method for manufacturing the same'20168,320,589'Electret condenser'20128,166,827'MEMS device and method for manufacturing the same'20128,146,437'Diaphragm structure and MEMS device'20128,067,811'MEMS device, MEMS device module and acoustic transducer'20117,853,027'Electret condenser'20107,847,359'MEMS device, MEMS device module and acoustic transducer'20107,620,192'Electret covered with an insulated film and an electret condenser having the electret'20096,451,707'Method of removing reaction product due to plasma ashing of a resist pattern'20026,291,350'Method of polishing semiconductor wafer'20016,251,000'Substrate holder, method for polishing substrate, and method for fabricating semiconductor device'20016,214,126'Method for cleaning a silicon substrate'20015,075,051'Molding process and apparatus for transferring plural molds to plural stations'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2018Patents assigned to CANON KK (4)· patent assignee history
1991–2018Based in Ushiku, JP· patent location history
2001–2002Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (3)· patent assignee history
2001–2019Based in Osaka, JP· patent location history
2001Based in Neyagawa, JP· patent location history
2009–2012Patents assigned to PANASONIC CORP (7)· patent assignee history
2010–2012Based in Niigata, JP· patent location history
2011–2012Patents assigned to MIYOSHI YUICHI (4)· patent assignee history
2011–2012Patents assigned to YAMAOKA TOHRU (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC CORP | 7 | 2009–2012 |
| CANON KK | 4 | 1991–2018 |
| MIYOSHI YUICHIself | 4 | 2011–2012 |
| YAMAOKA TOHRU | 4 | 2011–2012 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 3 | 2001–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 7 | 2001–2019 |
| Ushiku, JP | 4 | 1991–2018 |
| Niigata, JP | 4 | 2010–2012 |
| Neyagawa, JP | 1 | 2001 |