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Inventor

David Frederick Diefenderfer

Inventor
Manassas, VA, US

Overview

2→
Patents
1999–2001
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests33%
PatentTitleYear
6,171,873'Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information'20015,888,838'Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2001Patents assigned to IBM (2)· patent assignee history
1999–2001Based in Manassas, VA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM21999–2001
Locations
LocationPatentsSpan
Manassas, Virginia, US21999–2001