Inventor
Thilo Stolze
Inventor
Arnsberg, DE
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1054%
Y10TTechnical subjects covered by former us classification12%
H05KPrinted circuits10%
H01LSemiconductor devices8%
H01RElectrically-conductive connections4%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
G01RMeasuring electric variables2%
H01CResistors2%
H10DInorganic electric semiconductor devices2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
PatentTitleYear
9,891,247'U-shaped vertical shunt resistor for Power Semiconductor module'20189,373,563'Semiconductor assembly having a housing'20169,337,155'Semiconductor component with moisture barrier for sealing semiconductor body'20168,933,569'Pressure contact arrangement and method for producing a pressure contact arrangement'20158,643,188'Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector'20148,598,697'Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module'20138,593,817'Power semiconductor module and method for operating a power semiconductor module'20138,586,420'Power semiconductor arrangement and method for producing a power semiconductor arrangement'20138,563,364'Method for producing a power semiconductor arrangement'20138,514,579'Power semiconductor module including substrates spaced from each other'20138,446,726'Semiconductor module having an insert and method for producing a semiconductor module having an insert'20138,338,932'Power semiconductor module with interconnected package portions'20128,319,335'Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly'20128,253,237'Semiconductor module arrangement and method'20128,227,913'Power semiconductor module comprising elastic housing for accommodating movement of individual substrate regions on a heat sink'20128,215,008'Method for producing a housing part for a semiconductor module'20128,159,822'Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module'20128,134,837'Twist-secured assembly of a power semiconductor module mountable on a heat sink'20128,087,943'Power semiconductor module including a contact element'20127,919,854'Semiconductor module with two cooling surfaces and method'20117,701,054'Power semiconductor module and method for its manufacture'20107,477,518'Sub-assembly'20097,450,389'Sub-assembly'20087,291,914'Power semiconductor module'20077,034,395'Power semiconductor module with cooling element and pressing apparatus'20066,715,203'Substrate for power semiconductor modules with through-plating of solder and method for its production'20046,483,128'Connecting device for power semiconductor modules with compensation for mechanical stresses'20026,431,259'Spring clip for fixing semiconductor modules to a heat sink'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2006Patents assigned to EUPEC GMBH & CO KG (3)· patent assignee history
2002–2018Based in Arnsberg, DE· patent location history
2008–2018Patents assigned to INFINEON TECHNOLOGIES AG (22)· patent assignee history
2012–2016Patents assigned to STOLZE THILO (16)· patent assignee history
2012–2013Patents assigned to KANSCHAT PETER (5)· patent assignee history
2012–2013Patents assigned to HOHLFELD OLAF (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 22 | 2008–2018 |
| STOLZE THILOself | 16 | 2012–2016 |
| KANSCHAT PETER | 5 | 2012–2013 |
| HOHLFELD OLAF | 4 | 2012–2013 |
| EUPEC GMBH & CO KG | 3 | 2002–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Arnsberg, DE | 28 | 2002–2018 |