Inventor
Alexander Heinrich
Inventor
Regensburg, DE
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
B23KSoldering or unsoldering6%
C22CAlloys4%
H10DInorganic electric semiconductor devices4%
Y10TTechnical subjects covered by former us classification4%
F25DRefrigerators2%
H05KPrinted circuits2%
A47JKitchen equipment1%
PatentTitleYear
11,069,644Semiconductor device including a solder compound containing a compound Sn/Sb202110,874,802Data collection apparatus for attachment to an injection device202010,799,061Beverage preparation machine with single motor actuation202010,773,026Data collection apparatus for attachment to an injection device202010,707,158Package with vertical interconnect between carrier and clip202010,636,766Chip assembly202010,615,145Soldering a conductor to an aluminum metallization202010,566,309Multi-purpose non-linear semiconductor package assembly line202010,475,761Method for producing electronic device with multi-layer contact201910,262,959Semiconductor devices and methods of forming thereof201910,192,849Semiconductor modules with semiconductor dies bonded to a metal foil201910,014,275Method for producing a chip assemblage20189,837,381Method of forming a chip assembly with a die attach liquid20179,756,726'Electronic device and method of fabricating an electronic device'20179,735,126'Solder alloys and arrangements'20179,689,561'Lighting unit for a large electrical device'20179,683,278'Diffusion solder bonding using solder preforms'20179,673,170'Batch process for connecting chips to a carrier'20179,576,875'Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements'20179,490,193'Electronic device with multi-layer contact'20169,484,316'Semiconductor devices and methods of forming thereof'20169,209,080'Semiconductor device comprising a protective structure on a chip backside and method of producing the same'20159,034,751'Method for mounting a semiconductor chip on a carrier'20159,010,884'Backing piece for attaching an electrical component to a housing wall'20158,980,687'Semiconductor device and method of manufacturing thereof'20158,951,915'Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements'20158,883,101'Method for operating an exhaust gas system for an internal combustion engine'20148,828,804'Semiconductor device and method'20148,802,553'Method for mounting a semiconductor chip on a carrier'20148,637,379'Device including a semiconductor chip and a carrier and fabrication method'20148,630,748'Method and apparatus for access and/or starting verification'20148,283,756'Electronic component with buffer layer'20128,177,878'Bonding material with exothermically reactive heterostructures'20127,956,446'Semiconductor device and method'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2021Patents assigned to INFINEON TECHNOLOGIES AG (27)· patent assignee history
2011–2019Based in Regensburg, DE· patent location history
2012–2017Patents assigned to HEINRICH ALEXANDER (13)· patent assignee history
2014–2017Patents assigned to EICHINGER OLIVER (3)· patent assignee history
2014–2015Patents assigned to NIKITIN IVAN (3)· patent assignee history
2014–2015Patents assigned to EDER HANNES (2)· patent assignee history
2015–2017Based in Villingen-Schwenningen, DE· patent location history
2017–2021Based in Bad Abbach, DE· patent location history
2020Based in Will, CH· patent location history
2020Based in Biel-Benken, CH· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 27 | 2011–2021 |
| HEINRICH ALEXANDERself | 13 | 2012–2017 |
| EICHINGER OLIVER | 3 | 2014–2017 |
| NIKITIN IVAN | 3 | 2014–2015 |
| EDER HANNES | 2 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Regensburg, DE | 17 | 2011–2019 |
| Bad Abbach, DE | 11 | 2017–2021 |
| Will, CH | 2 | 2020 |
| Villingen-Schwenningen, DE | 2 | 2015–2017 |
| Biel-Benken, CH | 1 | 2020 |