Inventor
KWANG JOO LEE
Inventor
KR
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Jprimary
C09JAdhesives16%
H01LSemiconductor devices15%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds7%
C08LCompositions of macromolecular compounds6%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
C08JWorking-up2%
PatentTitleYear
12,460,113Adhesive composition for dicing tape and dicing tape including the same202512,448,490Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same202512,378,447Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereof202512,341,033Apparatus for separating semiconductor chip and method for separating semiconductor by using same202512,286,564Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same202512,065,595Adhesive sheet for temporary attachment and method for producing semiconductor device using the same202412,024,654Non-conductive film and manufacturing method of semiconductor laminate202412,006,308Adhesive composition for semiconductor circuit connection and adhesive film containing the same202411,993,731Adhesive composition for semiconductor circuit connection and adhesive film containing the same202411,939,494Resin composition for bonding semiconductor and adhesive film for semiconductor using the same202411,932,784Adhesive composition for dicing tape and dicing tape comprising the same202411,879,075Resin composition for bonding semiconductors, adhesive film for semiconductor using the same, dicing die bonding film, and method for dicing semiconductor wafer202411,834,415Adhesive composition for semiconductor circuit connection and adhesive film including the same202311,760,907Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same202311,702,520Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same202311,702,571Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same202311,527,503Method for manufacturing semiconductor package202211,515,245Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same202211,479,699Adhesive film for semiconductor202211,466,184Adhesive composition202211,466,178Back-grinding tape202211,424,153Back grinding tape202211,404,301Dicing die-bonding film202211,361,878Method for manufacturing insulating film and semiconductor package202211,178,730Method for manufacturing heating element2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to LG CHEMICAL LTD (25)· patent assignee history
2021–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LG CHEMICAL LTD | 25 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 25 | 2021–2025 |