Inventor
Heinz Pilz
Inventor
Berlin, DE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y02Pprimary
Y02PClimate change mitigation technologies in the production or processing of goods31%
H05KPrinted circuits23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
B05CApparatus for applying fluent materials to surfaces, in general8%
B22FWorking metallic powder8%
B29CShaping or joining of plastics8%
PatentTitleYear
10,105,758Arrangement for coating a powder20186,653,743'Electronic component mounted on a flat substrate and padded with a fluid filler'20036,445,074'Electronic component mounted on a flat substrate and padded with a fluid filler'20026,057,178'Method of padding an electronic component, mounted on a flat substrate, with a liquid filler'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2018Patents assigned to SIEMENS AG (4)· patent assignee history
2000–2003Based in Berlin, DE· patent location history
2018Based in Teltow, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SIEMENS AG | 4 | 2000–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Berlin, DE | 3 | 2000–2003 |
| Teltow, DE | 1 | 2018 |