Inventor
Yipeng Lu
Inventor
Davis, CA, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing18%
G06KGraphical data reading18%
G06VImage or video recognition or understanding18%
H01LSemiconductor devices12%
G02BOptical elements, systems or apparatus6%
G11BInformation storage based on relative movement between record carrier and transducer6%
H10KOrganic electric solid-state devices6%
H10NElectric solid-state devices not otherwise provided for6%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
Y02PClimate change mitigation technologies in the production or processing of goods6%
PatentTitleYear
11,126,814Ultrasonic fingerprint sensor with flexible substrate202111,087,107Ultrasonic sensor with bi-poled or uni-poled transmitter/receiver202111,087,108Fingerprint sensor system including metamaterial20216,452,787'Engaging and ejecting device for expansion module/cell of portable computer'20026,317,317'Insertion cartridge for hard disc of portable computer'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2002Patents assigned to COMPAL ELECTRONICS INC (2)· patent assignee history
2001–2002Based in Taipei, TW· patent location history
2021Patents assigned to QUALCOMM INC (3)· patent assignee history
2021Based in Davis, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 3 | 2021 |
| COMPAL ELECTRONICS INC | 2 | 2001–2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Davis, California, US | 3 | 2021 |
| Taipei, TW | 2 | 2001–2002 |