Inventor
Tan Nguyen
Inventor
Santa Clara, CA, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H05KPrinted circuits18%
G01RMeasuring electric variables9%
H01RElectrically-conductive connections9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
LOC129%
Y02PClimate change mitigation technologies in the production or processing of goods9%
Y10TTechnical subjects covered by former us classification9%
PatentTitleYear
D0840330Tire insert20196,541,874'Encapsulation of microelectronic assemblies'20036,329,224'Encapsulation of microelectronic assemblies'20016,197,665'Lamination machine and method to laminate a coverlay to a microelectronic package'20016,086,386'Flexible connectors for microelectronic elements'20005,882,221'Socket for semiconductor devices'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2003Patents assigned to TESSERA INC (5)· patent assignee history
1999–2003Based in Santa Clara, CA, US· patent location history
2019Patents assigned to Peram LLC (1)· patent assignee history
2019Based in Lancaster, PA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TESSERA INC | 5 | 1999–2003 |
| Peram LLC | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Santa Clara, California, US | 5 | 1999–2003 |
| Lancaster, Pennsylvania, US | 1 | 2019 |