Inventor
ARKALGUD SITARAM
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
C23FNon-mechanical removal of metallic material from surface13%
C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
C23CCoating metallic material6%
H01JElectric discharge tubes or discharge lamps6%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
12,575,391Methods for fabricating semiconductor devices with backside power delivery network using laser liftoff layer202612,506,112Method for etching of metal202511,866,831Methods for wet atomic layer etching of copper202411,610,846Protective elements for bonded structures including an obstructive element2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023Patents assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC (1)· patent assignee history
2023–2025Based in US· patent location history
2024–2026Patents assigned to TOKYO ELECTRON LTD (3)· patent assignee history
2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 3 | 2024–2026 |
| ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 3 | 2023–2025 |
| JP | 1 | 2026 |