Inventor
David Dong
Inventor
Shanghai, CN
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing28%
H05KPrinted circuits25%
G11BInformation storage based on relative movement between record carrier and transducer15%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact5%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%
F04DNon-positive-displacement pumps3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges2%
F25BRefrigeration machines, plants or systems2%
G06KGraphical data reading2%
PatentTitleYear
10,869,381Heat sink for plug-in card, plug-in card including heat sink, and associated manufacturing method202010,860,514Input/output card for use in storage device and storage device202010,825,483Heat sinking enclosure for disk array202010,746,219Screw, method of manufacturing the same and related storage devices202010,729,035Storage device and method for controlling rotation speed of fan of storage device202010,672,430Chassis and heat sink for use in chassis202010,666,519Determining a physical position of an electronic device202010,635,320Integrator for a storage device, corresponding storage device and method of manufacturing the same202010,624,235Apparatus integrated with cooling components and maintaining method thereof202010,602,602Heat sink for plug-in card, plug-in card including heat sink, and associated manufacturing method202010,588,237Adaptor for storage device202010,575,435Storage device and method for controlling rotation speed of fan of storage device202010,571,207Fixing device for double sided heat sink and associated heat dissipating system202010,545,547Device having time division multiplexing capability of heat dissipation202010,522,191Controlling fan speed based on hard disk assembly position201910,289,171Rack-mounted server201910,194,554Drive assembly, chassis assembly, and server device201910,139,874Heat sink for use in storage and associated storage201810,064,305Standard form factor electronic module carrier comprising multiple separately-removable sub-carriers20184,939,559'Dual electron injector structures using a conductive oxide between injectors'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990Patents assigned to IBM (1)· patent assignee history
1990Based in Peekskill, NY, US· patent location history
2018–2020Patents assigned to EMC IP HOLDING CO LLC (15)· patent assignee history
2018–2020Based in Shanghai, CN· patent location history
2020Patents assigned to DELL PRODUCTS LP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EMC IP HOLDING CO LLC | 15 | 2018–2020 |
| DELL PRODUCTS LP | 4 | 2020 |
| IBM | 1 | 1990 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shanghai, CN | 19 | 2018–2020 |
| Peekskill, New York, US | 1 | 1990 |