Inventor
Roland Irsigler
Inventor
Munich, DE
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H05KPrinted circuits9%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10TTechnical subjects covered by former us classification4%
G01RMeasuring electric variables2%
H01RElectrically-conductive connections2%
H10DInorganic electric semiconductor devices2%
H10KOrganic electric solid-state devices2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
8,598,716'Semiconductor apparatus having stacked semiconductor components'20138,124,521'Electrical through contact'20128,106,511'Reduced-stress through-chip feature and method of making the same'20128,072,084'Integrated circuit, circuit system, and method of manufacturing'20118,049,310'Semiconductor device with an interconnect element and method for manufacture'20118,048,479'Method for placing material onto a target board by means of a transfer board'20117,960,843'Chip arrangement and method of manufacturing a chip arrangement'20117,847,415'Method for manufacturing a multichip module assembly'20107,834,462'Electric device, stack of electric devices, and method of manufacturing a stack of electric devices'20107,829,380'Solder pillar bumping and a method of making the same'20107,646,090'Semiconductor module for making electrical contact with a connection device via a rewiring device'20107,638,869'Semiconductor device'20097,338,843'Method for producing an electronic component, especially a memory chip'20087,265,451'Semiconductor and method for producing a semiconductor'20077,247,948'Semiconductor device and method for fabricating the semiconductor device'20077,211,472'Method for producing a multichip module and multichip module'20077,211,451'Process for producing a component module'20077,087,512'Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions'20067,080,988'Flexible contact-connection device'20067,074,649'Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit'20067,022,549'Method for connecting an integrated circuit to a substrate and corresponding arrangement'20066,979,591'Connection of integrated circuits'20056,919,232'Process for producing a semiconductor chip'20056,897,088'Method for connecting circuit devices'20056,861,291'Method producing a contact connection between a semiconductor chip and a substrate and the contact connection'20056,845,554'Method for connection of circuit units'20056,714,418'Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another'20046,630,723'Laser programming of integrated circuits'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2010Patents assigned to INFINEON TECHNOLOGIES AG (17)· patent assignee history
2003–2013Based in Munich, DE· patent location history
2006–2012Based in München, DE· patent location history
2006Based in Deutschland, DE· patent location history
2009–2013Patents assigned to QIMONDA AG (11)· patent assignee history
2011–2013Patents assigned to HEDLER HARRY (4)· patent assignee history
2011–2013Patents assigned to IRSIGLER ROLAND (4)· patent assignee history
2012–2013Patents assigned to MEYER THORSTEN (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 17 | 2003–2010 |
| QIMONDA AG | 11 | 2009–2013 |
| HEDLER HARRY | 4 | 2011–2013 |
| IRSIGLER ROLANDself | 4 | 2011–2013 |
| MEYER THORSTEN | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Munich, DE | 20 | 2003–2013 |
| München, DE | 7 | 2006–2012 |
| Deutschland, DE | 1 | 2006 |