Inventor
Tzu-Chun Tang
Inventor
Kaohsiung, TW
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H01LSemiconductor devices20%
H01QAntennas, i.e. radio aerials18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H01FMagnets6%
H02JElectric power networks6%
B22FWorking metallic powder2%
B29CShaping or joining of plastics2%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering2%
G05BControl or regulating systems in general2%
PatentTitleYear
11,103,927Heat sink support structures in additive manufacturing202110,867,938Package structure202010,868,353Electronic device and manufacturing method thereof202010,825,602Stacked coil for wireless charging structure on InFO package202010,777,518Package structure and method of manufacturing the same202010,756,052Method of manufacturing integrated fan-out package202010,672,728Integrated fan-out package202010,510,714Packaged semiconductor devices and packaging methods201910,510,478Stacked coil for wireless charging structure on InFO package201910,510,681Semiconductor device201910,366,966Method of manufacturing integrated fan-out package201910,304,614Stacked coil for wireless charging structure on InFO package201910,269,481Stacked coil for wireless charging structure on InFO package201910,157,834Electronic apparatus201810,128,203Fan-out package structure, antenna system and associated method201810,050,013Packaged semiconductor devices and packaging methods201810,043,761Semiconductor device and manufacturing method thereof20189,601,439'Semiconductor structure and manufacturing method thereof'20179,312,608'Multiple-input multiple-output antenna device'20169,059,519'MIMO antenna device, antenna and antenna package'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015Patents assigned to HORNG TZYY-SHENG (1)· patent assignee history
2015Patents assigned to LIN KEN-HUANG (1)· patent assignee history
2015–2020Based in Kaohsiung, TW· patent location history
2016Patents assigned to TAI SAW TECHNOLOGY CO LTD (1)· patent assignee history
2016Based in Taoyuan County, TW· patent location history
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history
2021Patents assigned to SIEMENS IND SOFTWARE INC (1)· patent assignee history
2021Based in Plainsboro, NJ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 17 | 2017–2020 |
| HORNG TZYY-SHENG | 1 | 2015 |
| LIN KEN-HUANG | 1 | 2015 |
| SIEMENS IND SOFTWARE INC | 1 | 2021 |
| TAI SAW TECHNOLOGY CO LTD | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 18 | 2015–2020 |
| Plainsboro, New Jersey, US | 1 | 2021 |
| Taoyuan County, TW | 1 | 2016 |