Inventor
Guan Huei See
Inventor
Singapore, SG
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10DInorganic electric semiconductor devices17%
B24BMachines, devices, or processes for grinding or polishing3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
C09GPolishing compositions2%
C09KMaterials for miscellaneous applications, not provided for elsewhere2%
H10BElectronic memory devices2%
PatentTitleYear
10,636,696Methods for forming vias in polymer layers202010,515,927Methods and apparatus for semiconductor package processing201910,475,735Methods and apparatus for 3D MIM capacitor package processing201910,319,601Slurry for polishing of integrated circuit packaging201910,276,424Method and apparatus for wafer level packaging201910,229,827Method of redistribution layer formation for advanced packaging applications201910,211,072Method of reconstituted substrate formation for advanced packaging applications201910,062,710Integrated circuits with deep and ultra shallow trench isolations and methods for fabricating the same201810,020,394Extended drain metal-oxide-semiconductor transistor201810,002,771Methods for chemical mechanical polishing (CMP) processing with ozone20189,954,051Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring20189,922,868'Integrated circuits using silicon on insulator substrates and methods of manufacturing the same'20189,922,874'Methods of enhancing polymer adhesion to copper'20189,899,514'Extended drain metal-oxide-semiconductor transistor'20189,685,364'Silicon-on-insulator integrated circuit devices with body contact structures and methods for fabricating the same'20179,472,512'Integrated circuits with contacts through a buried oxide layer and methods of producing the same'20169,230,990'Silicon-on-insulator integrated circuit devices with body contact structures'20169,087,906'Grounding of silicon-on-insulator structure'20158,946,819'Silicon-on-insulator integrated circuits with local oxidation of silicon and methods for fabricating the same'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2018Patents assigned to GLOBALFOUNDRIES SG PTE LTD (9)· patent assignee history
2015–2020Based in Singapore, SG· patent location history
2018–2020Patents assigned to APPLIED MATERIALS INC (10)· patent assignee history
2018Patents assigned to MORI GLEN T (1)· patent assignee history
2018Patents assigned to SEE GUAN HUEI (1)· patent assignee history
2018Patents assigned to SUNDARRAJAN ARVIND (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 10 | 2018–2020 |
| GLOBALFOUNDRIES SG PTE LTD | 9 | 2015–2018 |
| MORI GLEN T | 1 | 2018 |
| SEE GUAN HUEIself | 1 | 2018 |
| SUNDARRAJAN ARVIND | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 19 | 2015–2020 |