Inventor
Lu-Chen Hwan
Inventor
Taipei, TW
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits12%
H01QAntennas, i.e. radio aerials9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Y10TTechnical subjects covered by former us classification9%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein6%
H10HInorganic light-emitting semiconductor devices having potential barriers6%
B23KSoldering or unsoldering3%
G01RMeasuring electric variables3%
G06KGraphical data reading3%
PatentTitleYear
9,136,585'Radio frequency identification tag'20159,105,814'Light emitting diode and method of the same'20158,344,734'Test module for radio frequency identification chips and method of the same'20138,344,500'Integrated circuit package module and method of the same'20137,999,191'Method for making cable with a conductive bump array, and method for connecting the cable to a task object'20117,943,426'Package structure for integrated circuit device and method of the same'20117,886,421'Method for manufacturing integrated circuit device having antenna conductors'20117,772,698'Package structure for integrated circuit device'20107,698,805'Method for manufacturing integrated circuit device having antenna conductors'20107,459,345'Packaging method for an electronic element'20087,413,670'Method for forming wiring on a substrate'20087,312,142'Method for making cable with a conductive bump array, and method for connecting the cable to a task object'20077,273,768'Wafer-level package and IC module assembly method for the wafer-level package'20076,940,183'Compound filled in lead IC packaging product'20056,602,762'System and method of laser sintering dies and dies sintered by laser sintering'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003Patents assigned to CHIPBOND TECHNOLOGY CORP (1)· patent assignee history
2003Based in Hsinchu, TW· patent location history
2005–2015Based in Taipei, TW· patent location history
2007–2015Patents assigned to MUTUAL PAK TECHNOLOGY CO LTD (12)· patent assignee history
2011Based in Xinzhuang City, TW· patent location history
2013–2015Patents assigned to HWAN LU-CHEN (4)· patent assignee history
2013–2015Patents assigned to CHEN PO CHING (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MUTUAL PAK TECHNOLOGY CO LTD | 12 | 2007–2015 |
| HWAN LU-CHENself | 4 | 2013–2015 |
| CHEN PO CHING | 2 | 2013–2015 |
| CHIPBOND TECHNOLOGY CORP | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 13 | 2005–2015 |
| Xinzhuang City, TW | 1 | 2011 |
| Hsinchu, TW | 1 | 2003 |