Inventor
Motomu Degai
Inventor
Toyama, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material25%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10DInorganic electric semiconductor devices19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
PatentTitleYear
11,004,676Method for manufacturing semiconductor device, non-transitory computer-readable recording medium, and substrate processing apparatus202110,355,098Method of manufacturing semiconductor device20199,984,887Method of manufacturing a semiconductor device20189,368,358'Method of manufacturing a semiconductor device'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2019Patents assigned to HITACHI INT ELECTRIC INC (3)· patent assignee history
2016–2021Based in Toyama, JP· patent location history
2019–2021Patents assigned to KOKUSAI ELECTRIC CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI INT ELECTRIC INC | 3 | 2016–2019 |
| KOKUSAI ELECTRIC CORP | 2 | 2019–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 4 | 2016–2021 |